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Primer 205
One component, solvent-free, epoxy resin based water-borne adhesion promoter. Suitable for use on smooth and low and non-absorbent substrates, before applying levelling layers and cementitious adhesives.
One component, solvent-free, epoxy resin based water-borne adhesion promoter. Suitable for use on smooth and low and non-absorbent substrates, before applying levelling layers and cementitious adhesives.